Research and development etching device SPE40
Research and development etching device SPE40
【Process】Input → Etching → Liquid Drain → Circulation Water Wash → Direct Water Wash → Squeeze → Extraction 【Substrate Size】Max. W400×L500mm Thickness 0.4〜2.0mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1300×L1590×H1215mm - Space-saving for research use - Ideal for material development and testing - Capable of etching PCBs and LCDs
